My machine (a 7455 G4/933) started to behave erratically since the weather turned hot a few days ago. Things like uboot would not reboot (dumping hex values all over the screen), hd reads being largely trashed etc.
I took time to remove the unefficient ThermalTake thing (discovering btw that the thermal compound beneath includes a textile layer which can hardly be considered as an efficient thermal flow conductor, which makes me feel like the ThermalTake is better suited for nice-looking mobos as a chipset fan... Additionnally, the ThermalTake's plastic fan has already more or less self-destroyed already after less than 1 year of use, having a high power-off torque probably due to dust friction.

Look here for a detail of the thermal compound below the ThermalTake, including a view of the textile layer.

I've taken time to make a proper cooling for my G4, made out of a Pentium heatsink (60 x 60 x 30 mm), on which is fixed a brand new 60 x 60 mm AMD fan from a Duron fan+sink, plus the usual Zalman thermal compound (just a bit, on the G4 die itself).

The sink has been drilled with 2 holes matching those in the CPU module, and is firmly fit in place by a pair of screws with insulator washers, absolutely flat on the G4 die, but not too tight, not to bend the CPU module PCB, of course. Additionnally, the small caps around just procure a set of points that lie just below the G4 die surface (lets say less than 1.10th mm), which makes it easy to align.

I did not use the AMD sink, because it is definately too big & heavy, & would have put a mechanical constraint on everything that would be too much.

Look here for a detail of the kind of Duron sink+fan on which i picked the fan (mine is not this one, but the same from AMD).

Look here for a view of the Pentium Sink, under which the AMD fan has been screwed. The sink is cleaned, and drilled with the two holes which will receive the 2 screws through the CPU module's PCB.

Look here for a view of the CPU module, after removal of the ThermalTake sink, and cleaning of the TT thermal paste traces.

Look here for a detail of the Duron wegde pads, that I pasted on the G4 to help balance the sink position.

Look here for a detail of the CPU module just before mounting the sink, with Zalman thermal compound on the G4 die. On the left, you can see the sink/fan combo ready to be assembled with the CPU module.

Look here for a detail of the CPU module associated with the new sink/fan, with the 2 black screws mounted on plastic insulating washers.

Look here for an overview of the new cooling system in place, on the A1 mobo.

Look here for a detail of the new cooling system.

Since I installed that, the machine runs for hours without erratic behaviour, except the crashes I expect when I provoke them.

FYI, look at what Apple puts on 800 MHz G4's here or anywhere...